Thermal Compound For Heat Sink

The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation.

Thermal compound for heat sink. All the energy is absorbed by the cpu grease to ensure it only flows to the heatsink and not to any of the computer s internal circuitry something that is of particular importance for gaming pcs. Will not harden or melt. Free in store or curbside pick up. As opposed to thermal adhesive thermal paste does not add mechanical strength to the bond between heat source and heat s.

Since the grooves between the heatsink and the processor aren t perfectly even the thermal compound is perfect for use as a conduit to facilitate better heat transfer. Thermal paste is a thermally conductive chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices. Wells heat sink compound 1 ea. Wigbow thermal compound paste heatsink paste carbon based high performance thermal compound cpu for all coolers thermal interface material high durability 4 grams 1 pack 4 6 out of 5 stars 315 6 99 6.

These compounds are commonly used with transistors diodes rectifiers and transformers. Thermal paste is an example of a thermal interface material. Excellent heat transfer efficiency. 1 1 of 1 results.

Parts are just part of what we do. Get yours online today and pick up in store. This is a test. Heat sink compounds bond heat sinks to surfaces eliminating air gaps for maximum heat transfer.

Temperature range from 45 degrees f to 500 degrees f. Silicone compound blended with thermally conductive fine metal oxide powders. Will not react to rubber or plastic.