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Most rubber thermal pads have a high durometer and take large amount of force to deform the shape and thickness of the pad.
Thermal interface material pad. In computing and electronics thermal pads also called thermally conductive pad or thermal interface pad are pre formed rectangles of solid material often paraffin wax or silicone based commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled such as a cpu or another chip and into the heatsink usually made from aluminium or copper. Laird gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance. Resolve dry out cracking and silicone migration issues by replacing mica and thermal grease applications with cleaner and reproducible rubber materials.
Protection between the fan blades and foreign objects and thermal conductivity between devices. Bergquist gap pad tgp 10000ulm is a formulation that provides exceptionally high thermal conductivity of. Laird s extensive gap filler product lines includes a wide range of. Irvine california henkel today announced the expansion of its award winning thermal interface materials tims portfolio with the addition of a product developed to address the high power density challenges associated with new 5g telecom infrastructure and consumer mobility designs.
These accessories serve purposes such as ensuring efficient airflow between the fan and the components.
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